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- 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
- Phone: (661) 257-2288
FAX: (661) 257 -3833
- lel@ukam.com
Choosing the right blade diamond or cbn blade can significantly impact efficiency, cost, and quality. However, this is not simple and clear cut process. Selecting the optimal blade involves navigating a complex landscape of trade-offs, where factors such as cutting speed, surface finish, blade longevity, and cost must be carefully balanced. This article explores the critical performance trade-offs associated with diamond and CBN blades, providing insights to help you make informed decisions that align with your specific cutting requirements and operational goals. Understanding these trade-offs is essential for optimizing your processes, enhancing productivity, and achieving superior results in your cutting applications.
Diamond wafering blades are designed for sectioning a large variety of materials and sample types. In order to identify the best diamond wafering blade for your specific material/application, we have implemented a grading system that spans diamond mesh/particle sizes from 5 (the finest) to 30 (the coarsest). This scale helps users select the appropriate blade for their specific sectioning requirements. A blade designated as number 10, for instance, will feature larger diamond particles than one rated at No. 5; however, the increase in particle size is not directly proportional, meaning they are not simply twice as large. Furthermore, we have provided cross-references to Buehler, Struers, and Leco part numbers, allowing you to easily find the equivalent diamond or CBN wafering blade for your needs.